Full Site - : lead free solder to gold plated component (Page 3 of 17)

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions

Videos

Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to

BEST Inc.

Adhesion Testing - How to Do it!

Adhesion Testing - How to Do it!

Videos

Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in

ASKbobwillis.com

Desktop covenyor Reflow Oven R350 from prototyping to full production.

Desktop covenyor Reflow Oven R350 from prototyping to full production.

New Equipment | Reflow

Desktop covenyor Reflow Oven R350 from prototyping to full production. Desktop covenyor Reflow Oven R350 from prototyping to full production. Product Description Introduction: R350 mini reflow oven R350 is the first inline lead free reflow oven

Beijing Torch Co.,Ltd

Hentec Industries/RPS Publishes an Engineer's Guide to Component Re-Conditioning Process

Industry News | 2021-04-13 17:37:07.0

Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.

Hentec Industries, Inc. (RPS Automation)

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

FCT Assembly to Demonstrate NanoSlic® Gold Stencil at SMTAI

Industry News | 2014-08-25 16:35:50.0

FCT Assembly will exhibit in Booth #221 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

FCT ASSEMBLY, INC.

AIM's Karl Seelig to Present at the Upcoming PERM Meeting

Industry News | 2012-01-24 20:35:41.0

AIM announces that Karl Seelig, Vice President of Technology, will discuss the reliability of lead-free alloys at the upcoming PB-Free Electronics Risk Management (PERM) Consortium Meeting, scheduled to take place January 31-February 2, 2012 in Arlington, Va.

AIM Solder

AIM to Showcase NC259 Solder Paste at IPC Midwest

Industry News | 2012-07-25 10:17:38.0

AIM, will highlight its new NC259 Solder Paste

AIM Solder

Circuit Technology Center to Increase Component Level Modification Services Capacity

Industry News | 2021-08-25 16:20:31.0

Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Nihon Superior to Exhibit TipSave N at APEX 2020

Industry News | 2020-01-06 16:02:00.0

Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.

Nihon Superior Co., Ltd.


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