Industry Directory | Manufacturer
FINTEK has been a leading manufacturer in the precision press industry in Taiwan, and we have special expertise in manufacturing metal folding machines, shearing machine.
Industry Directory | Manufacturer
XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.
The HEPCO Model T3700-2 is a Heavy-Duty Shear Machine for the majority of radial-leaded components, including connectors, transistors, coils, trimpots, DIP ICs and capacitors. The steel frame and stainless steel cylinder, coupled with the high-flow
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
Electronics Forum | Wed Nov 18 05:21:18 EST 1998 | jack coia
Please could anyone give me any relative information concerning shear tests on the leads of SMD ICs. thanks in advance.
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Used SMT Equipment | Other Equipment
Wanted, Hepco T3700 Radial Component Lead Shear prep machine. Thanks Ed
Used SMT Equipment | THT Equipment
Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
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Parts & Supplies | AOI / Automated Optical Inspection
UNIVERSAL 30997505 SLICE The following is a list of some of our products: if you can't find the part number, you can contact becky@hysmt.cn No. Part Number Description 1 43366107 FORMER,LEFT STD 2 43366207 FORMER,RIGHT STANDARD 3 45
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Parts & Supplies | Pick and Place/Feeders
AI BLADE SHEAR STD LH ..44241803 We also supply following Universal Spare parts : 43366204 FORMER,RIGHT 46806904 FORMER, INSIDE R JW 42348504 FORMER 43366114 FORMER,OUTSIDE J/W LH 43366202 FORMER,RIGHT HVY LD 43366214 FORMER,OUTSIDE J/W RH
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
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Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Woodbury, Minnesota USA | Management,Production
Over 20 yrs experience in SMT. Worked with medical, industrial, communications, aerospace and automotive electronics. Have experience working in ITAR controlled companies.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/46805213-shear-blade-143073?page=80&category=1131
> UNIVERSAL Shear Blade 46805213 | QYSMT, High-quality AI spare parts supplier, Panasonic, Universal and TDK Radial Lead / Axial Lead Component Insertion Machine spare parts
Heller Industries Inc. | https://hellerindustries.com/bit_publications/effect-of-reflow-profile-on-snpb-and-snagcu-solder-joint-shear-force/
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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