Used SMT Equipment | Soldering - Selective
Model: 103 Selective Soldering System, with: • Lead-Free Solder Pot • Fine Pitch Camera for Precise Soldering • Manufactured in 2004 • Fully Programmable Axis and Drop-Jet Interface Condition: Complete and Operational Location & Shipping: US
Used SMT Equipment | Soldering - Selective
Vintage: 2007 Operating System: Windows XP Details: • Lead Free Condition: Complete & Operational Location & Shipping: USA / FOB Origi
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Used SMT Equipment | Soldering - Selective
Details: • Dual Pot (1)Lead and (1) Lead Free Condition: Complete & Operational Location & Shipping: USA / FOB Origin Availability: Immediate for purchase
Used SMT Equipment | Soldering - Reflow
Details: • 8 Heating Zones • 2 Cooling Zones • Lead-Free • Edge Hold conveyor • Windows Operating System • 208V Condition: Complete & Operational Location & Shipping: USA / FOB Origin
Used SMT Equipment | Soldering - Selective
Vintage: 2011 Software: PC Windows XP O.S Details: • Two Pots, Lead Free and Lead “Interchangeable Pots” • Nozzles • Boardsize 2x2 up to 18X24 • Topside Preheat • Spray fluxer Condition:
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Panasonic MSR Feeder Set up Jig / Feeder Loading Unit Size: L260*W360*H150(MM) G.W: 17KG Can load 3 pieces of feeders
Used SMT Equipment | Soldering Equipment/Fluxes
Model: FlexSolder W620 Vintage: 2012 (demo’ed only, never used!) Description: Inline soldering system. (With servo driven XYZ gantry, and tilt able gripper from 0° to 7° degrees for direct PCB handling) Details: • Spray fluxer •
