Industry News | 2021-01-04 12:44:32.0
The following is a statement by Chris Mitchell, vice president of global government relations at IPC, the global electronics manufacturing association, on recent actions by the U.S. Government to bolster the security and resiliency of the U.S. defense electronics supply chain.
Industry News | 2012-07-24 11:04:04.0
The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 15, 2012 as a focused symposium at SMTA International in Orlando, FL.
Industry News | 2014-08-03 19:58:55.0
The SMTA announced that the Evolving Technologies Summit will be held on September 29, 2014 as a focused symposium at SMTA International in Rosemont, Illinois.
Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2014-11-17 18:24:17.0
IPC APEX EXPO 2015 technical conference and professional development sessions, which will take place February 22-26 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.
Industry News | 2017-05-16 17:59:37.0
PCB Technology Trends 2016, a global study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2021 that will affect the whole industry.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
.png)
.jpg)