Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2010-10-01 01:27:06.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces the release of Pace Replacement Pre-Filters (OEM Part Number 8883-0111-P5) for Arm-Evac and Lab-Evac 105/200/250 fume extraction filtration systems. The replacement pre-filters provide up to 30 percent savings over original Pace Pre-Filters, making production more affordable. Count On Tools Pace Replacement Pre-Filters are available in packs of five for $70 and ship for free via First Class Mail*.
Industry News | 2011-03-17 19:14:35.0
Count On Tools Inc. announces the release of Pace Replacement Pre-Filters (OEM Part Number 8883-0111-P5) for Arm-Evac and Lab-Evac 105/200/250 fume extraction filtration systems. The replacement pre-filters provide up to 30 percent savings over original Pace Pre-Filters, making production more affordable.
New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
Industry News | 2015-06-12 08:33:43.0
BEST Inc has released the new IPC solder certification training kit corresponding to version F. This kit can be used to train in both lead-bearing and lead-free solders and features a "real" PCB.
Technical Library | 2015-10-29 18:19:33.0
With the electronic industry moving towards lead-free assembly, traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow temperature required by lead-free solders. Lead-free compatible laminates with improved heat resistance have been developed to meet this challenge but they are typically more brittle than SnPb laminates causing some to be more susceptible to pad cratering. In this paper, two novel approaches for minimizing pad cratering will be discussed. Preliminary results which validate the two approaches will also be presented.
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
