Technical Library | 2024-01-16 22:29:59.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consiste
Technical Library | 2013-01-09 18:31:54.0
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes designed to reduce Z-axis expansion and improve the materials resistance to thermal excursions through primary attach and rework operations have also produced harder resin systems with reduced fracture toughness.
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
New Equipment | Wave Soldering
Automatic wave solder system with self-contained fluxing, preheating and laminar (smooth) solder wave modules. Wave Solder Machines for Lead-Free Soldering Medium to High Volume Production Automatic wave solder system Best value through
New Equipment | Wave Soldering
Automatic wave solder system with self-contained fluxing, preheating and laminar (smooth) solder wave modules. Wave Solder Machines for Lead-Free Soldering Medium to High Volume Production Automatic wave solder system Best value through
A high speed micro via drilling system, the GS-600 incorporates a dual laser system for the highest throughput and hole quality. Capable of producing up to 900 holes/second, the hole diameters can range from 0.001" to 0.010". The GS-600 is compatib
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
New Equipment | Wave Soldering
Economic, low to medium, automatic, 11.8" (310mm) wave soldering system with "L" finger conveyor for pallet or pallet-less board transport. The EWS-310 Wave Soldering Machine provides quick loading of PCBs from the onload conveyer extensions onto t
Industry Directory | Consultant / Service Provider / Manufacturer
World Leaders in Solder Recovery.
