Industry News | 2013-07-29 13:51:15.0
MIRTEC Co., Ltd. “The Global Leader in Inspection Technology,” today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth # A-1E45 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2019-11-12 13:01:33.0
MIRTEC has won an EM Best of Industry Award in the category of Automated Optical Inspection for its MV-6e OMNI. The award was presented to Bentec Distributor Accurex during a ceremony that took place 26 September at the Stellar Gymkhana in India. Bentec is the Managing Partner for UK/Ireland and India for MIRTEC.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2009-07-12 14:19:25.0
Seoul Korea — July 2009 — MIRTEC, “The Global Leader in Inspection Technology,” announces that the company has been awarded contracts totaling more than $15M with leading mobile solution manufacturers for its MV-7xi inline automated optical inspection (AOI) systems.
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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