Electronics Forum | Wed Oct 04 10:18:51 EDT 2006 | greg york
Now seen the Blow Holes and shallow inverted and non wetting problem an aweful lot over here. Over came the Blow Holes and shallow inverted joints by washing the bare PCB with hot Saponifier then rinse and dry = problem dissapears. Think most PCB ven
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
Electronics Forum | Mon Dec 03 12:15:51 EST 2007 | rgduval
We've just completed an experiment for one of our customers using lead-free HASL. From a manufacturing standpoint, everything seemed to have run fine. Solder profiling seemed to be unaffected, pick and place was unaffected, and the end result looke
Electronics Forum | Tue Oct 03 22:48:21 EDT 2006 | C.K. the Flip
It sounds as if this Sn100c HASL process is still in its infancy requiring further process development and characterization..weather its a better more active flux or a different profile... Given your situation of the Sn100c coating actually "repellin
Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Tue Nov 11 19:41:06 EST 2008 | gregoryyork
Thats the problem residual residue from HASL fluxes Lead free especially are worse.Very hygroscopic and out gass and produce dewetting as well over wave soldered boards especially. Leave iron on blown joint and will after several seconds fizz and pop
Electronics Forum | Tue Aug 31 13:23:37 EDT 2004 | frankracine
Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the co
Electronics Forum | Tue Mar 15 07:59:07 EST 2005 | mattkehoe
We are looking for some feedback on this situation. Please let us know if you have any ideas. Thanks in advance. I have been doing some studies on defects and such with our PCB's in prep for lead free and I've come to a conclusion about our process.
Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork
I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
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