Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
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There are three solutions for improving the productivity even more with the latest NXT III related software.
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Universal Instruments positioned its electronics assembly solutions portfolio in the forefront of an evolving industry landscape to enjoy market success in 2011. The company’s product and solutions roadmaps were well-aligned in anticipation of a global technology shift, resulting in a leadership position in the emerging “green” markets, an expanded customer base and a Q4 2011 global market share gain of nearly 2% versus the prior year.
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Torenko & Associates partners with SMTVYS Technology providing increased level of professional sales and support for all regions of Mexico.
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OEMs See Need for More U.S. Sourcing of Custom Parts and Services
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CyberOptics® Corporation (NASDAQ: CYBE) today announced that it will exhibit in Booth #814 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase CyberOptics’ newly launched SQ3000™ 3D AOI system.
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CyberOptics today announced that it will exhibit in Hall A2, Booth 459 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will showcase CyberOptics’ new SQ3000™ 3D Automated Optical Inspection (AOI) system and launch advanced new product features.
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