Industry News | 2022-02-25 14:45:48.0
Juki Automation Systems (JAS), Inc. is pleased to announce that it received two 2022 CIRCUITS ASSEMBLY NPI Awards. The company was awarded in the categories of Component Placement – Multi-function for the JM-50 and Component Storage for the new ISM UltraFlex 3600S. The awards were announced during a special online ceremony on Thursday, Feb. 24, 2022.
Industry News | 2008-06-16 21:03:28.0
Agilent Technologies Inc. (NYSE: A) today introduced two additional modules for its 34980A multifunction switch/measure unit. The modules extend this solution's high-performance capabilities with even higher switching density and flexible measurements with automatic surge protection. These high-density modules are a cost-effective alternative to PXI and VXI test platforms.
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2010-06-28 17:29:55.0
Expanding on its seven existing SMT lines, Reno, Nevada-based contract manufacturer EE Technologies (EET) recently added a state-of-the-art eighth assembly line specifically to showcase its unique approach to rapid prototype production. Having had a very positive experience with the DEK printers in its other seven lines, EET again choose DEK and has installed the company’s latest technology, a Horizon 03iX platform, to extend its rapid prototype capability.
Industry News | 2012-02-08 17:06:35.0
Universal Instruments positioned its electronics assembly solutions portfolio in the forefront of an evolving industry landscape to enjoy market success in 2011. The company’s product and solutions roadmaps were well-aligned in anticipation of a global technology shift, resulting in a leadership position in the emerging “green” markets, an expanded customer base and a Q4 2011 global market share gain of nearly 2% versus the prior year.
Industry News | 2012-04-10 15:19:51.0
SMT Hautes Technologies has further leveraged its alliance with Universal Instruments to enhance the company's capabilities and bolster its position as a leading-edge EMS provider. SMT Hautes has purchased an Advantis® AC-90T Platform for its Montreal, Canada production facility, extending its growing Universal Instruments surface mount production portfolio. The new high-speed machine is currently achieving 3X the throughput in half the footprint of the previous equipment set.
Industry News | 2014-02-28 18:54:49.0
Electronics manufacturing has become increasingly challenging as customers want ever more complex boards, densely populated with components delivering more functionality from less space. Cupio Yestech Europe has always recognised this reality, and owes many of their customer relationships to meeting it successfully. They have recently extended their investment in this area by taking on Ben Seviour as a support and bespoke software development specialist.
Industry News | 2015-12-15 18:11:46.0
ADLINK Technology announces the agreement with PrimTech Ltd. concerning the 100% share acquisition of PrismTech Ltd. by ADLINK Technology based on the resolution of the board meeting held on Dec 14th, 2015.
Industry News | 2016-11-24 19:49:30.0
CyberOptics® Corporation announces it will showcase its next-generation Airborne Particle Sensor technology (APS2) with an extended particle size range at the upcoming SEMICON Japan in Tokyo, December 14-16, 2016 in booth #4605.
Industry News | 2017-01-11 17:14:16.0
Mentor Graphics today announced that TSMC has extended its collaboration with Mentor Graphics on the Xpedition® Enterprise platform in conjunction with the Calibre® platform for the design and verification of TSMC’s InFO (Integrated Fan-Out) packaging technology for multi-chip and chip-DRAM integration applications. Mentor developed new Xpedition functionality specifically to support InFO and enable the IC package designer to complete design tasks to TSMC specification. By leveraging the capabilities of both the Calibre and HyperLynx® technologies, the new Xpedition functionality minimizes the designer effort and design rule checking (DRC) cycles required to achieve a DRC-clean InFO GDS file.
