Industry News | 2011-03-02 17:28:40.0
Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2011-10-08 20:53:49.0
Seica presenting the Pilot V8 Flying Prober with automatic loader, the innovative in-circuit and functional line tester, Compact SL, and the model Top-bottom of Firefly Laser Selective Soldering.
Industry News | 2012-01-21 00:40:52.0
Essemtec will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo.
Industry News | 2013-01-14 14:43:06.0
Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO
Industry News | 2013-04-10 11:48:47.0
Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2016-07-08 19:09:41.0
Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.
Industry News | 2017-07-07 17:15:03.0
Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).
Industry News | 2018-09-13 18:10:17.0
series is Seica’s latest innovative flying prober on the market today. It’s ability to test traditional loaded boards is unmatched in today’s market, but also its ability to test wafers, substrates, MLOs and assemblies is quite extraordinary. From NPI pilot runs to full production runs, with its fast ICT test capabilities the system can also be configured to regenerate netlists and schematics for circuit assemblies that have no data whatsoever. The system can also be configured for functional testing such as; power up, boundary scan, flash programming, and LED testing or using Seica’s functional language the user can create their own test code or run National Instruments TeststandTM Labview sequences. Seica will also discuss many other product offerings from bed of nails testers, to automation equipment, conformal coat and THT (Dragonfly) test systems, and our laser based selective solder system called the Firefly.
Siemens Siplace X4 Pick And Place Machine Siemens Siplace X4 Pick And Place Machine Patch speed:120000CPH Dimension:1900×2734MM Weight: 3460kg Product description: Siemens Siplace X4 Pick And Place Machine,Patch speed:120000CPH, Dimensio
Siemens Siplace X4 Pick And Place Machine Siemens Pick and Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplace X4 Pick And Place Machine-4 rotary IC head 120000CPH, Patch speed:120000CPH,
