Industry Directory | Manufacturer's Representative
Representative company in Singapore/Malaysia/Thailand/Philippines/Indonesia/Vietnam/China
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Industry News | 2020-12-01 02:54:29.0
MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Industry News | 2022-05-17 02:13:27.0
High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine
Industry News | 2022-05-17 02:13:47.0
High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine
Industry News | 2022-05-17 02:13:57.0
High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine
Technical Library | 2021-04-01 14:36:51.0
This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
.jpg)
