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MVP 850 DWMS

MVP 850 DWMS

New Equipment | Inspection

The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-

Machine Vision Products, Inc

Dynavest Pte Ltd

Industry Directory | Manufacturer's Representative

Representative company in Singapore/Malaysia/Thailand/Philippines/Indonesia/Vietnam/China

HYDRON® SE 230A

HYDRON® SE 230A

Videos

Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro

ZESTRON Americas

MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages

Industry News | 2020-12-01 02:54:29.0

MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.

MacDermid Alpha Electronics Solutions

STATS ChipPAC Inc

Industry Directory | Other

STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.

Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

Technical Library | 2018-05-23 12:12:43.0

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.

Robert Bosch LLC Automotive Electronics Division

Semi-conductor Loader & Un-Loader

Industry News | 2022-05-17 02:13:27.0

High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine

Samtronik International Limited

Semi-conductor Loader & Un-Loader

Industry News | 2022-05-17 02:13:47.0

High Speed Mini Unloader of Semiconductor High Speed Mini Unloader of leadframe High Speed Mini Unloader of magazine

Samtronik International Limited


leadframe searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
ISVI High Resolution Fast Speed Industrial Cameras

High Resolution Fast Speed Industrial Cameras.
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Handling Machine with CE

Reflow Soldering 101 Training Course
PCB separator

Private label coffee for your company - your logo & message on each bag!