Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
New Equipment | Board Handling - Conveyors
Lead Frame Loaders and Unloaders are available in a variety of configurations. We custom design your system to Auer, Perfection and other small magazines. Designed for Clean Room use, we can offer high capacity by running our magazine buffer to the r
Used SMT Equipment | Semiconductor & Solar
DMC Leadframe Marker
Used SMT Equipment | Semiconductor & Solar
Leadframe Transport Conveyor
Used SMT Equipment | Semiconductor & Solar
Leadframe Shuttle Conveyor 2 in 2 out
Used SMT Equipment | Semiconductor & Solar
Leadframe Magazine Unloader Nr. 1
Used SMT Equipment | Conveyors
Asys AD Oracle Exhaust System for DMC Leadframe Marker wanted. Please email me with details.
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
