Industry News | 2008-05-23 18:09:23.0
LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).
Industry News | 2011-01-05 17:46:58.0
Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.
Industry News | 2011-11-08 14:17:32.0
Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
Industry News | 2015-11-04 20:35:17.0
Carlsbad, CA – November 5: Machine Vision Products today announced it would be demonstrating a wide variety of SMT and Microelectonics applications at the Productronica 2015 exhibition. The exhibition is at Messe München in Munich from November 10th to 13th 2015. Machine Vision Products are exhibiting on Booth 270 in Hall A2.
Industry News | 2008-12-06 02:17:55.0
Further advancing the capabilities of modern die attach technology, Henkel has developed and made commercially available a line of new Ablestik� brand die attach materials known as self-filleting die attach. The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and much less costly alternative to die attach films.
Industry News | 2010-11-03 21:54:19.0
Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.
Industry News | 2012-08-31 12:32:09.0
Carlsbad, CA – September 1, 2012: Machine Vision Products today announced they would be demonstrating their 850G Inspection solutions at the Semicon Taiwan 2012 exhibition. The exhibition is at the Taipei World Trade Center, Nangang Hall in Taipei, Taiwan from September 5-7 2012. Machine Vision Products are exhibiting on Booth #960 with Sigmatek Corp.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
