Electronics Forum | Thu May 06 17:23:02 EDT 2004 | davef
Ah, here it is: EFTEC-64T. A commercial leadframe material with the nominal composition of Cu-0.3Cr-0.25Sn-0.2Zn
Electronics Forum | Tue Apr 26 03:28:26 EDT 2005 | Just mee
What test is applicable to check for QFN package with NiPdAu leadframe if leads/pad are solderable? what are the options other than dip and look solderability testing? Thanks,
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Fri Jul 30 18:34:51 EDT 2010 | ranas
hi, just want to seek info regarding LF supplier who can do flip chip LF with solder nuggets. our supplier from USA is going to be closed due to financial constraint.. Anybody who can recommend.. asia location is preferrable.. thanks, Ranas
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Mon Sep 16 03:10:32 EDT 2002 | stefano_bolleri
Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, ther
Electronics Forum | Wed Jun 22 09:42:51 EDT 2005 | davef
Not sure what a higher Tg laminate will accomplish. Can't hurt though. Remember, when soldering to Alloy 42, the surface is 42% nickel. So, you need to raise the reflow temperature some 15 to 20*C over what is needed for copper. Also, sometimes All
Electronics Forum | Mon Jul 04 09:01:22 EDT 2005 | Rob
Hi, I don't know if it will help but we talked about soldering Nickel on this thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8051&#Message31803 where we used Cobar solder paste for soldering all types of
Electronics Forum | Wed May 03 02:23:11 EDT 2017 | Rob
Many years ago (20+) we did this by preassembling the 2 parts into a mini leadframe with high temp solder paste, which was a pain but then they could be dropped in trays, surface mounted and hit the line clean. I'm guessing you have a low value cap
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
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