Electronics Forum | Fri May 17 15:51:32 EDT 2002 | davef
First thing that comes to mind is that your �dip & look� testing at 240�C clearly doesn�t represent the in-use application of 215�C. So, what are the test results at 215�C? Other questions are: * Can we assume that the solderability of other compon
Electronics Forum | Fri May 17 22:25:51 EDT 2002 | xzinxzin
*the other components are 0402 and SOIC 16, the solderability were good. *the protection on the terminations of microleadframe package is Cu(copper),somebody call that leadless leadframe package(LLP). *the time above 210 deg C is about 10 sec. *I us
Electronics Forum | Tue Apr 01 09:36:25 EST 2003 | davef
You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining t
Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS
Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO
Electronics Forum | Fri Aug 08 07:27:43 EDT 2008 | lonta96
Hi, I'm from a semiconductor package assembly, and currently looking for an offline solder paste inspector capable of true volume measurement. Any recommendation for a machine that can measure paste volume on a leadframe (metal substrate)? I found
Electronics Forum | Tue Sep 16 16:45:44 EDT 2008 | trynders
Thanks for the response! I thought is was odd the component vendor chose SAC for a lead frame finish. I am in the Military world, and things have been difficult to control from a lead-free standpoint. I have not been able to find any studies on SAC
Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach
I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime
Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee
I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate
Electronics Forum | Sat May 29 15:55:04 EDT 1999 | M Cox
| Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to a F
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
