Electronics Forum | Sat May 29 15:55:04 EDT 1999 | M Cox
| Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to a F
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Wed Mar 08 15:12:41 EST 2006 | aj
All, I have a problem on a new device that we have on a new product. It is a LLP (Leadless Leadframe Package) if you search in google "sda16a" you can see one. I am finding it next to impossible to consistently achieve a good visible solder fillet
Electronics Forum | Fri Oct 03 07:49:18 EDT 2003 | mk
Mask Musings. Soldermask (SM) and its functions have changed and evolved over the years. As an ex-solder mask applicator, I can remember screening Colonial High Gloss Epoxy soldermask on boards back in the early 80's, ending up with a thickness that
Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey
| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr
Electronics Forum | Sat May 29 22:20:56 EDT 1999 | Earl Moon
| | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to a
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Sun May 30 11:43:23 EDT 1999 | M Cox
| | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to
