Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Sun May 30 12:33:36 EDT 1999 | Earl Moon
| | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according
Electronics Forum | Sun May 30 15:11:10 EDT 1999 | M Cox
| | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accordin
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie
Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa
Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon
| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord
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