Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
Industry Directory | Consultant / Service Provider / Manufacturer
Advanced Assembly provides quality PCB assembly services for prototypes and low-quantity orders 87% faster than other shops.
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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
New Equipment | Rework & Repair Services
STI has qualified technicians trained in IPC 7711/7721, as well as in custom design solutions, to address your electronic rework and repair needs. STI’s services encompass both mainstream assembly technologies (surface mount and through-hole) as well
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Used SMT Equipment | Pick and Place/Feeders
Board size L50xW50mm – L460 xW410mm Board thickness 0.5mm-2.0mm Flow direction Left to right Conveyor speed Max. 420mm/sec, speed variable, soft stop fuction Placement speed A (NB1) 0.13 sec/CHIP, 0.38 sec/TSOP32 Placement speed B
Used SMT Equipment | Other Equipment
SMD Chip Counter CU2000B APPLICTION ï¼ By using the principle of photoelectric sensing, COU2000 Series SMT Chip Counter can take the advantage of the relations between the sprocket holes and the parts and count the SMD parts accurately and quickl
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2008-08-14 13:20:36.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Parts & Supplies | Chipshooters / Chip Mounters
155806 STEPPER MOTOR, REAR 155804 STEPPER MOTOR, FRONT 155786 SQY'S HOME LOOM BOM 145686 BEARING, ANGULAR CONTACT 140327 SOLID STATE PUSH BUTTON SWITCH 112545 DOWEL 3DIA X 12LG GRD 1 112414 CABLE
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Parts & Supplies | Chipshooters / Chip Mounters
700689 WASHER M5 BLACK PLASTIC 700404 SCREW M4X6 CSK.SLTD.M/C ST.ST 700402 SCREW M3X8 CSK.SLTD.M/C ST.ST 700401 SCREW M3X6 CSK.SLTD.M/C ST.ST 700313 SCREW M4X10 BUTT.HD ST.ST 700118 SCREW M5X25 CAP HD ST.ST 171299 CARRIER^CASSETTE
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2011-10-27 18:03:53.0
Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row
L181E821000 OPERATION GUIDE COLLAR L182E021AB0 REAR MONITOR ASM L184E921000 SWITCH PANEL OP L185E021000 HOD ASSEMBLY L185E0210A0 HOD ASSEMBLY L186E521000 OP UD STOPPER L190E021000 CHIP BOX L190E0210A0 HARD DISK ASM(ST) E1403706A00 C
L181E821000 OPERATION GUIDE COLLAR L182E021AB0 REAR MONITOR ASM L184E921000 SWITCH PANEL OP L185E021000 HOD ASSEMBLY L185E0210A0 HOD ASSEMBLY L186E521000 OP UD STOPPER L190E021000 CHIP BOX L190E0210A0 HARD DISK ASM(ST) E1403706A00 C
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale
| https://www.eptac.com/wp-content/uploads/2013/06/eptac_06_19_13.pdf
| http://etasmt.com/cc?ID=te_news_bulletin,7161&url=_print
. It is a surface-mounting component (SMC/SMD, Chinese called chip component) that is packaged in a matrix of leadless or short leads or balls, mounted on the surface of a Printed Circuit Board (PCB
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