Industry News | 2008-09-08 03:46:39.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.
Industry News | 2014-08-12 16:03:12.0
(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
Industry News | 2009-03-18 17:08:59.0
FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2010-03-26 23:23:54.0
NASHVILLE - Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present a paper titled "Validity of the IPC R.O.S.E. Method 2.3.25 Researched," written in cooperation with Steve Stach, Austin American Technology, at the upcoming IPC/APEX conference and exhibition.
Industry News | 2008-08-07 15:31:41.0
NASHVILLE � August 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will both present and chair technical sessions during the 2008 SMTA International Conference and Exhibition, scheduled to take place August 18-20, 2008, at the Coronado Springs Resort in Orlando, FL.
Industry News | 2021-05-10 02:50:10.0
BSU Inc. has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc...
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
Industry News | 2019-06-11 10:33:49.0
KYZEN announced plans to exhibit at SEMICON West, scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco, CA. The KYZEN team will offer free cleaning assessments and an inside look at their chemistries, MICRONOX® M2322 and MICRONOX® M2708, in Booth #5369.
Industry News | 2017-05-03 21:11:11.0
StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages.
The SUSS MicroTec MA100RR Reel-to-Reel Proximity Mask Aligner is specifically designed for volume production of tape for tape carrier packages (TCP) and flex based chip scale packages (CSPs), like the �BGA. The tool can also be used for products requ
.gif)
.gif)
