Parts & Supplies | Chipshooters / Chip Mounters
There is stock for sale. If you are interested, please contact us for a quotation by email. Email: info@qosmt.com
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Tape Splicer, Splicing Tape, Tape Splicer, Splice Tape for splicing carrier tapes, mag-d electronics, magdelectronics, mag-delectronics, mag-d, mag d electronics, mag d, Surface mount feeders for bare dies and flip chips, Tape splice and splice tape
Technical Library | 2013-02-08 22:56:47.0
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed.
New Equipment | Tape and Reel Equipment
1. Usage : To connect between the running cassette reel tape and new cassette tape reel without stopping or pause at chip-mounter (Using splice clip & tape) * Used to General Purpose Chip-Mounter & Multi Function(Flexible) Chip-Mounter 2. Application
Industry Directory | Manufacturer
Manufacturers flexible printed circuits, circuit materials, IC packaging substrates, laminates, conductive coatings and tapes
Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Functional demonstration of a Soltec DeltaMax fully functional, prepared by the Capital Equipment Exchange.
Industry News | 2002-04-05 08:29:22.0
Detected an Undisclosed Error With Its CDMA2000 1X MSM5100 and MSM5105 Chip Sets and Software
