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Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
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SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
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Industry News | 2003-03-11 08:34:08.0
The guidelines were developed to present information to comprehensively test and accurately diagnose the complex circuitry produced in modern electronics manufacturing.