Industry News | 2019-12-16 22:07:54.0
UVLED curing machine is generally used for UV glue, UV ink and other UV coating curing, can achieve the purpose of rapid deep curing, the principle is UV irradiation special glue causes glue to produce polymerization reaction to cure.
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
Ruichi Standard Soldering Robot R351. Soldering Tip can be designed according to your products.
Two stations, one for soldring and the another is for goods loading at the same time. So it doubled the production efficiency
Industry Directory | Manufacturer
Dez Smart Tech specializes in SMT optional equipments. We offer selective soldering machine, cleaning machine(stencil, printing screen, nozzle, squeegee, condenser, fixture & jigs), reballing and BGA rework station
Industry Directory | Consultant / Service Provider / Manufacturer
Lepla srl electronic contract manufacturer, specialized in the SMT & THT Electronic Cards Assembling, Wiring Assembling Harness, In-Circuit, Parametric and Functional Testing.
Shenzhen zhuomao is located in Shenzhen, China.SHENZHEN ZHUOMAO TECHNOLOGY CO.,LTD - Seamark Group The leading manufacturer of BGA/SMT rework, X-ray inspection system, TV LCD panel laser repair for 13 years in China. Established in 2005, we have coo
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
