The inspection of welded tanks is a time-costly procedure. Modern real-time DR-systems result in a huge efficiency gain in comparison to the conventional film (RT) approach. VisiConsult developed a cutting edge custom system with weld tracking, defec
Brief Introduction NeoDen3V is an upgraded version of TM245P series. It features dual head, 44 feeder slots, vision system and flexible positioning system, which is suitable for prototyping, small-medium batch production with stable performance and
Electronics Forum | Fri Apr 20 07:30:14 EDT 2001 | wbu
In short: the measured deviation / the length this deviation occurs * 100% = % of deviation Actually we encounter mostly "twist" so we put the board on a flat surface, hold it down at the corners to see if any of the corners lifts, measure the heig
Electronics Forum | Mon Apr 23 11:44:55 EDT 2001 | CAL
650 Standards are also located in the back of IPC JSTD-001. I am currently looking at 4 pages on bow and twist. Percent bow = R1-R2/L x 100 (R1= Highest point; R2=lowest or resting point; l= length) Percent twist=(R1-R2)/(2xL)x 100 Sorry if this is
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Technical Library | 2007-08-02 13:24:23.0
This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Events Calendar | Tue Sep 17 00:00:00 EDT 2024 - Tue Sep 17 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: Risk Assessment of Metallic and Non-Metallic Particles and Fibers
Heller Industries Inc. | https://hellerindustries.com/parts/458271/
458271 - Thermocouple Wire, w/ spot weld and male connector(3000mm length) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://www.eptac.com/webinar/faqs-clarification-and-interpretation-of-a-variety-of-ipc-standards/
. Definition of burnt flux residue, class defects and its’ implications. Foreign Object Debris (FOD) in and on PC boards. Course Length: 35 Minutes Cost: FREE Presenter(s): Leo Lambert Download PDF Presentation Watch On Demand More Webinars Flux Classification
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