Electronics Forum | Mon May 26 08:02:11 EDT 2003 | davef
Resistance: Tables of wire gauge often provide a resistance measure of some kind for each gauge. That way we can estimate the resistance of any length of wire we might be interested in. Calculating trace resistance is only slightly more complicated.
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad
I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Thu Oct 12 09:20:22 EDT 2017 | stefan110882
Hello everyone, I would like to know how you interpret the wetting angle in chapter 5. What is meant with: "...solder contour extending over the edge of the solderable termination area or solder mask..." Thanks ps I know what a solder mask is.
Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt
Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds
Electronics Forum | Mon Dec 12 14:05:45 EST 2005 | derengmao
I tried to use the Fixed Camera to inspect TSOP, however, I got either "UPPER SIDE END PIN ERROR", or "Missing Group:1". I have never had a parts getting recognized. I adjusted all parameter possible: Light, size, width, length. By using Dispaly Par
Electronics Forum | Thu May 10 19:22:06 EDT 2007 | joeherz
We have a board that requires a .015 - .035" finished lead length which requires us to do mass lead trimming. To this point we've performed this activity on parts with straight leads. We're looking at going to an axial auto-insertion process (outso
Electronics Forum | Thu Oct 12 13:15:37 EDT 2017 | davef
It is the two conditions pictured in IPC-A-610F, Figure 5-1 C, D. In the old, simplier days, we wanted our solder connection to have: * Low wetting angle * Shiny metal Today, the metal doesn't have to be shiny and the wetting angle can be a high
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
