Full Site - : length of terminal (Page 10 of 36)

Guide of Siemens Pressure Transmitter: Features, Working Principle and Troubleshooting

Industry News | 2021-12-15 20:08:31.0

Siemens pressure transmitter is a kind of equipment which converts pressure into pneumatic signal or electric signal for control and remote transmission. It can convert the physical pressure parameters such as gas and liquid sensed by the load cell sensor into standard electrical signals (such as 4 ~ 20mADC), which can be supplied to the secondary instruments such as indicating alarm instrument, recorder and regulator for measurement, indication and process adjustment.

OKmarts Industrial Parts Mall

Study on the Performance of Single Phase AC-DC-AC Inverter Circuit

Industry News | 2021-10-31 21:32:05.0

At present and in the future, the maintenance of the electrical control equipment, VFD (Variable Frequency Drive) will become the professional knowledge that all electricians need to master. As a reliable supplier of leading brands of VFDs for many years, OKmarts now shares ten simple and easy maintenance methods to the majority of VFD maintenance technicians. Hopefully these experience can help you in the maintenance of VFDs.

OKmarts Industrial Parts Mall

Study on the Performance of Single Phase AC-DC-AC Inverter Circuit

Industry News | 2021-12-06 20:13:05.0

At present and in the future, the maintenance of the electrical control equipment, VFD (Variable Frequency Drive) will become the professional knowledge that all electricians need to master. As a reliable supplier of leading brands of VFDs for many years, OKmarts now shares ten simple and easy maintenance methods to the majority of VFD maintenance technicians. Hopefully these experience can help you in the maintenance of VFDs.

OKmarts Industrial Parts Mall

Electrostatic Theory of Metal Whiskers.

Technical Library | 2014-07-31 16:36:59.0

Metal whiskers often grow across leads of electric equipment and electronic package causing current leakage or short circuits and raising significant reliability issues. The nature of metal whiskers remains a mystery after several decades of research. Here, the existence of metal whiskers is attributed to the energy gain due to electrostatic polarization of metal filaments in the electric field. The field is induced by surface imperfections: contaminations, oxide states, grain boundaries, etc. A proposed theory provides closed form expressions and quantitative estimates for the whisker nucleation and growth rates, explains the range of whisker parameters and effects of external biasing, and predicts statistical distribution of their lengths.

University of Toledo

Maximizing Production Productivity of Automatic Termination Machines

Technical Library | 2007-11-08 18:49:44.0

ways to increase machine utilization and productivity for automatic termination machines. This article will discuss just a few of the basic concepts. For some, this may seem academic, but going over the basics is a good reminder so we don’t overlook best practices. So, how do we get more products out the door every day?

Schleuniger, Inc.

Reliability Study of Bottom Terminated Components

Technical Library | 2015-07-14 13:19:10.0

Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.

Flex (Flextronics International)

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.

MARCH Products | Nordson Electronics Solutions

CAMI Develops Capability of Checking Twist Pair Relationships in Cables as Short as Six Feet

Industry News | 2018-08-21 09:19:50.0

Celebrating its 25th anniversary, CAMI Research Inc. (Acton, MA), manufacturer of the CableEye automation-ready cable and harness test system, has developed the capability of checking and measuring twist pair relationships in cables as short as six feet. This feature is now standard in the model M4 low voltage continuity tester, and available as an option for HiPot (HVX-series) testers. The same circuitry allows for measuring cable length, length to break, capacitance, and resistance with precision (4-wire).

CAMI Research Inc.

In-line inspection of LED lights up to 2000 mm with very high accuracy

Industry News | 2018-09-05 20:30:39.0

For extra-long electronic assemblies, Viscom offers inspection solutions that realize demanding handling tasks without a problem. Their high inspection accuracy, wide inspection scope and rapid inspection speed predestine the 3D AOI and 3D SPI systems from Viscom for high-end electronics – particularly for LED lights.

Viscom AG

Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies

Technical Library | 2020-01-22 22:52:02.0

Flip chip assembly techniques bring a wide range of benefits: Reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances, especially for high speed signals. Reduce the device size and weight,…, etc. But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected.

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