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New New New at Nepcon

Industry News | 2007-04-25 09:05:17.0

You can always be sure of finding something new at Nepcon. New equipment, new processes, new applications, new businesses, new people, and new ways of doing old things. Nepcon 2007 at the NEC this May is no exception with more than 30 new companies.

Reed Exhibitions

honeywell 51196968-100 9.1 GB HARD DRIVE

honeywell 51196968-100 9.1 GB HARD DRIVE

New Equipment | Industrial Automation

51196968-100 9.1 GB HARD DRIVE EA 51191579-30051196969-100 MOTOROLA PENTIUM II 300 MHz PC DESKTOP EA 51196969-200 MOTOROLA PENTIUM II 300 MHz PC DESKSIDE EA 51196969-900 KEYBD/MOUSE KIT -US (66433577 MOTOROLA PART) EA 51196969-901 KEYBOARD/MOUSE EA 5

zhengzhou yuzhe electronic technology co.,ltd

Moisture Sensitive shelf life

Electronics Forum | Mon Aug 22 18:25:54 EDT 2016 | cox1

I have a MS level 3 component that has been on the shelf for 7 years. Should it be baked before usage. The HIC card reads ok- and it was stored with desiccant. History of the part is unknown, was purchased from franchised distribution.

PCB over shelf life

Electronics Forum | Fri Dec 17 02:43:24 EST 2010 | grahamcooper22

Ideal storage conditions to stop pcbs absorbing moisture is at less then 5% RH, for example in sealed moisture barrier bags. You mention that storage was at 40~70%...at these levels the pcb will absorb quite a bit of moisture. Your baking time was no

PCB with ENIG plating shelf life?

Electronics Forum | Thu Nov 10 20:39:44 EST 2022 | SMTA-64386598

The solderability shelf life of ENIG is related almost entirely to diffusion of O2 through the gold plating. When O2 diffuses through the gold, the underlying nickel is oxidized rendering it unsolderable (with ENIG - you solder to Ni, the gold dissol

How you pack & ship your board level assemblies?

Electronics Forum | Fri Feb 16 03:02:02 EST 2018 | robl

100% agree with dwl. last year one of our 3rd party delivery partners got rear ended resulting in about 30% of a $120,000 shipment being written off. If it hadn't been for foam lined flight cases we would have lost the lot. Also for smaller 3rd pa

PCB SHELF LIFE AFTER FIRST REFLOW

Electronics Forum | Mon Feb 09 08:34:50 EST 2015 | saoasasd

In my case most of the PCBs are OSP finishing and worst case of MSD component on bottom side is level 3 (168 hours). You mean that PCB shelf life with bottom side assembled shoud be 84 hours?

Re: humidity in PC packages

Electronics Forum | Mon Jun 21 16:11:41 EDT 1999 | John Thorup

| | I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? | Usually a proper m

Looking for IPC or other standard for electronics / electro-mech

Electronics Forum | Mon May 07 08:46:18 EDT 2001 | CAL

Searching the IPC website is a good start. http://www.ipc.org Some standards you may want to look over are.... IPC 600, IPC 610, J-STD-001 "riveting and circuit cards into metal shelf" definitely has my curiosity level elevated. Since you know your

0402 placement skew

Electronics Forum | Mon Jul 09 20:46:22 EDT 2001 | davef

Is the glue intended for printed SMD attach? 3 Are you following all the manufacturer�s glue shelf life recommendations? 4 Are you observing all the manufacturer�s glue working life guidelines? Finally, what level of skewing are we talking about?


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