FUJI Pick and Place Robot M3 III Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place mach
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
New Equipment | Board Handling - Pallets,Carriers,Fixtures
wave solder pallets,processs carriers we can provide 24 to 48 hour turn around upon request
Our products had been widely used in mechanical and electronic industries, etc. Our main products include: 1. Synthetic Stone(the same quality of Durostone material): with black, gray, blue and red colors, etc. 2. Glass Fibre board: 3241 semiconduct
Industry News | 2014-02-13 16:40:22.0
Kurtz Ersa North America will display the proven POWERFLOW e N2 at the IPC APEX EXPO. The compact full tunnel wave soldering system significantly reduces solder consumption as well as the unit cost attributable to the process.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi
Description Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and other specialty soldering fixtures.
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
.jpg)
