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New Equipment | Rework & Repair Equipment
Semi-automatic BGA Rework Station ZM-R6200 WhatsApp/wechat/Skype：+86 18779975930 Email: sales25@zhuomao.com.cn China Biggest BGA Rework Station Manufacturer Repairing Micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, PCB, All Mobile Phone Board LED ( LED
New Equipment | Rework & Repair Equipment
X-ray inspection machine & LED/BGA rework station & X-ray counter for SMT Contact me for more information: skype:ritaleeli Email:sales11@zhuomao.com.cn whatsapp:0086 134 3448 1030 1, Main Features: Widely used in the Chip Level Repair i
New Equipment | Industrial Automation
About SIEMENS Its electronic and electrical products are global industry pioneers and are active in energy, medical, industrial, infrastructure and urban business fields. Skype : dddemi33 QQ :2851195473 Sales Manager : Tiffany Guan Email m
New Equipment | Industrial Automation
A5E00282025/04 EAM - Enhanced Analog Module 1):All quote are basic on EX-WORK 2):Delivery time: 5-7 days 3):Payment Term:T/T 4):ship to you via DHL/TNT/UPS/EMS/Fedex. Skype : dddemi33 QQ :2851195473 Sales Manager : Tiffany Guan Email m
Industry News | 2010-09-03 03:33:19.0
Bob has been invited to present four workshops at SMTA International and one live interactive session on the exhibition floor in October. Bob will be covering PoP, Coating, Counterfeits, QFN and how to Dye and Pry????
Industry News | 2017-01-09 08:56:28.0
The solder paste and stencil printing photo CD-ROM album featuring over 300 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The images can be downloaded or provided on CD ROM
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Industry News | 2016-04-08 14:12:30.0
IMAPS New England is 1 month away! VISIT YINCAE Booth Join Dr. Yin’s Presentation May 3rd, 1PM
Industry News | 2016-04-25 09:07:46.0
IMAPS New England is 1 week away! VISIT YINCAE Booth # 101 Join Dr. Yin’s Presentation May 3rd, 1PM
