Industry Directory | Manufacturer's Representative
MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
Technical Library | 2020-07-02 13:29:37.0
Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
New Equipment | Test Equipment
Application Computer Control Electro-Hydraulic Servo Universal Testing Machine is suitable to test various metallic & non-metallic materials for tension, compression, bending and shearing strength. It can be capable of testing the characters of mate
Industry Directory | Consultant / Service Provider
JY offers a great quality production or solution with a reasonable price on a short lead-time. we are not only producing products but also giving out a better solution for testing or connecting.
Industry Directory | Manufacturer
XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.
Yamaichi Electronics is an international manufacturer of Memory Card connectors, test & burn-in-sockets, production sockets, test contactors, and high-density connectors.
Industry Directory | Manufacturer
Vision SMT is professional SMT house.PCBA including BGA,3D AOI inspection, X-ray inspection,selective soldering, in-line coating , testing.
