Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Industry News | 2015-04-02 18:36:37.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand B-1F28 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Nordson DAGE’s team of Test and Inspection experts will demonstrate the 4000Plus Bondtester and XD7600NT Diamond FP X-ray inspection system.
Industry News | 2014-12-11 17:22:23.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.
Industry News | 2004-09-29 21:38:11.0
Frenchtown, NJ, September 2004
Industry News | 2014-03-26 08:17:39.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 NPI (New Product Introduction) Award in the category of Test and Inspection – Functional Test for its Camera Assist Automatic Bondtesting.
Industry News | 2015-06-11 16:18:49.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.
Industry News | 2015-04-21 15:58:48.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-Functional Testing for its Camera Assist Automatic Bondtesting. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2016-07-30 19:34:22.0
Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
