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New Equipment | Rework & Repair Equipment
Semi-automatic BGA Rework Station ZM-R6200 WhatsApp/wechat/Skype：+86 18779975930 Email: sales25@zhuomao.com.cn China Biggest BGA Rework Station Manufacturer Repairing Micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, PCB, All Mobile Phone Board LED ( LED
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Industry Directory | Manufacturer's Representative
SMT assembly equipment including placement, reflow & vapor phase soldering, cleaning, X-Ray, AOI, SPI, conveyors. First Article Inspection (FAI). Consumables, splicing systems & tools, splice tape & clips. Understencil wiping Roll
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Our Global Sales Manager Dirk Schade introduces the Condor Sigma Lite at SMT/Hybrid/Packaging 2013 in Nürnberg, Germany. A bond tester that can grow with your company. Put it to the test! For more information, go to www.xyztec.com https://www.xyztec
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
Industry News | 2003-07-08 09:09:15.0
Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz
Industry News | 2016-01-25 10:53:14.0
Seika Machinery is pleased to introduce the MALCOM PCU-02V Spiral Viscometer. PCU-02V is designed for expensive material testing and analysis by obtaining the viscosity characteristics with only a 0.2cc sample.
New Equipment | Rework & Repair Equipment
Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering We provide customized SMT inspection and repairing solution , Contact me for more information: whatsapp/wechat/viber:0086-134 3448 1030 Zhuomao new ZM-R7
Industry News | 2004-11-10 18:04:10.0
Frenchtown, NJ, November 2004
