Electronics Forum: lga solderbility percentage (2)

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 14:11:24 EST 2017 | kojotssss

EMIL, The first stencil was with 4 squares. then there was a worse percentage. Changed to the circles. Is better, but still not perfect. Stencil thickness did not change. I added 2 types of stencil openings. Pictures of watch:

BGA Voiding for RoHS

Electronics Forum | Fri Nov 13 06:56:37 EST 2009 | CL

Good Morning, The customer is looking for void free connections. They had never specified an acceptable percentage. We are reacting to the test yield. Our yield has averaged 50%. We do not test the product so we rely on feeback from the customer. Us

Career Center - Resumes: lga solderbility percentage (1)

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

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Express Newsletter: lga solderbility percentage (54)


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