Industry News | 2017-04-10 12:59:20.0
Pickering Interfaces will showcase their broad catalogue of PXI, PCI and Ethernet LXI products and software solutions at SMT Hybrid Packaging 2017 on 16-18 May in Hall 4A, Booth 141 in Nuremburg, Germany.
ProSoft Technology, Inc. develops industrial communication interface solutions for Rockwell Automation.
Technical Library | 1999-05-07 08:57:51.0
As a first step towards a perceptual user interface, a computer vision color tracking algorithm is developed and applied towards tracking human faces. Computer vision algorithms that are intended to form part of a perceptual user interface must be fast and efficient. They must be able to track in real time yet not absorb a major share of computational resources: other tasks must be able to run while the visual interface is being used. The new algorithm developed here is based on a robust nonparametric technique for climbing density gradients to find the mode (peak) of probability distributions called the mean shift algorithm.
Technical Library | 2014-08-19 16:07:15.0
Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs.
Technical Library | 2014-12-11 18:00:09.0
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared
Technical Library | 2017-04-28 07:53:37.0
A major drawback to Industry 4.0 that few write about is maintenance of an industry 4.0 plant. The maintenance aspect is a much greater and immediate drawback than even the commonly known major concern of security, and the lesser concern of system integration standards. Maintenance of 4.0 systems has, and will continue to result in related huge increases in process downtime. The barriers to overcoming the maintenance/downtime drawbacks of a 4.0 system are almost insurmountable. Has the Smart Manufacturing Leadership Coalition (SMLC) addressed the maintenance paradox? “... model also demands the ability to calculate and manage risk and uncertainty within very different operating structures. ..” Continue reading in pdf or for even more see and share http://bin95.com/Industry40inUSA.htm
Industry News | 2003-04-02 08:27:45.0
eM-Assembly Expert 2.0 is a major upgrade to the proven electronics assembly and test solution from Tecnomatix Unicam.
Industry News | 2014-07-23 13:05:22.0
Mentor Graphics today announced its next offering in the new Xpedition® platform, the Xpedition Data Management (xDM) product suite. The xDM Design product suite provides a flow-wide information hub that manages the PCB design data that is created, reused, imported, or released from the Mentor Graphics® Xpedition Enterprise platform.
New Equipment | Test Equipment
Measures DIO, Analog Voltage and Frequency in One Module. The JT 2149/DAF is a compact, mixed-signal (Digital/Analog/Frequency) measurement module and is the first unit of its type to offer both digital and analogue test access to PCBs via JTAG Tech
Industry News | 2018-03-11 11:24:23.0
Pickering Interfaces will showcase their broad catalogue of PXI, PCI, LXI, cabling products, and software solutions at AMPER 2018, 20-23 March 2018. These include the following products:
