Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2021-01-27 04:40:58.0
The 2021 Electrical Wire Processing Expo (EWPTE) originally scheduled at the Wisconsin Center in Milwaukee, Wis. for May 11-13, 2021 has been postponed to May 10-12, 2022. As show managersof the 2021 EWPTE,WHMA/IPC and Wisconsin Center Districtstaff met with the newly formed EWPTE exhibitor advisory board. The advisory board comprised of representatives from the following companies: Amphenol CTI, Anixter, Artos, Brady Corporation, Cesar-Scott, DIT-MCO,Dynalab Test Systems, HellermannTyton, IEWC, Komax, Molex, Schleuniger Inc.,Southwire Company, TE Connectivity and Telsonic unanimously made the critical decision to postponethe event due to ongoing concerns with COVID-19.
Industry News | 2021-11-24 15:25:19.0
Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
Industry News | 2023-07-22 03:24:39.0
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This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 1999-07-20 09:28:38.0
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment...
Technical Library | 2016-09-15 17:10:40.0
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliability data for printed wiring board (PWB) materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions. Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown / degradation of the composite printed circuit board material and mechanical structure over time and temperature for mission critical applications.
Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
