Industry Directory | Manufacturer / Other
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Sun Aug 28 23:53:58 EDT 2016 | aemery
I don't think there is a camera off message in the software, but I might be wrong. So I am making a bit of an assumption here that you didn't have a displayed image and your error was a fiducial not found error. I am also wondering if you decided to
Electronics Forum | Tue Nov 01 18:00:07 EST 2005 | PWH
The front nozzle plate arm had a build-up of grease and material on the roller plate that is closest to the linear bearing. This material caused the nozzle plate to be lower than normal; therefore it was not able to push the nozzle all the way to th
Used SMT Equipment | THT Equipment
Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O
Used SMT Equipment | Pick and Place/Feeders
Spare parts for Universal Radial and Axial through-hole insertion machines (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O'RING 15755 O'RING 15759
Industry News | 2019-12-11 06:21:54.0
Superpower lasers are characterized by small size, light weight, high electro-optic conversion efficiency, stable performance, high reliability and long life. At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating.
Industry News | 2008-05-12 19:31:09.0
Microelectronics Manufacturing (CAMM) located at the Endicott Interconnect Technologies, Inc. facility was inaugurated on Monday, March 31st, in a ceremony attended by business, political and community leaders.
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Parts & Supplies | Pick and Place/Feeders
XPF S1021A CIR-CLIP RATING ST-EW-3 FUJI xp142/xp143 original brand new BODY (honeycomb) ADNPH8810 FUJI xp142/xp143 original brand new Z-axis screw (BALL SCREW) DNPH2549 FUJI xp142/xp143 original brand new Z-axis screw (bearing) H4218K FUJI xp14
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Parts & Supplies | Pick and Place/Feeders
FUJI XPF PM41952 PIN FUJI xp142/xp143 original brand new BODY (honeycomb) ADNPH8810 FUJI xp142/xp143 original brand new Z-axis screw (BALL SCREW) DNPH2549 FUJI xp142/xp143 original brand new Z-axis screw (bearing) H4218K FUJI xp142/xp143 origin
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/category/fuji-others-smt-parts-1145/page/96?order=name+asc
0.0 CNY Plate Dispersion ¥ 0.00 0.0 CNY Plate Dispersion ¥ 0.00 0.0 CNY Plate Lower ¥ 0.00 0.0 CNY Plate Lower ¥ 0.00 0.0 CNY Plate connecting ¥ 0.00
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Contour-Mapping-Calibration-User-Guide-221MAPDOC-5.pdf
elevation below the top surface of the conveyor rails or work area plate. NOTE: The top surface of all devices within the work area must be lower than the top surface of the conveyor rails or work area so the mapping glass plate will be level. 3/12/18 5 GPD
