Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Mon Dec 02 12:33:45 EST 2002 | blnorman
Shelf life dates are normally conservative. Years ago we would "requalify" adhesives by running lapshear tests. Don't know if Loctite has a "requalification" test or not. I do know that we have used Loctite chipbonders that were over a year out of
Electronics Forum | Mon Dec 02 16:55:49 EST 2002 | steve
On a lot of Loctite products there is a shelf life stated via a lot number on the bottle. It has been my experience as a distributor that Loctite will in most instances re-certify a product for an extended period of time, sometimes up to a year based
Industry News | 2012-04-04 15:31:23.0
Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is
Industry News | 2010-11-04 12:19:39.0
Krayden, Inc., a leading distributor of engineered materials, introduces Henkel’s Frekote 55-NC, an improved version of the Frekote 44-NC, offering quicker evaporation times and less odor.
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
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