Electronics Forum | Fri Apr 30 01:11:00 EDT 1999 | Dean
| We will be moving our entire plant in a couple of months . We are in the process of installing communication cable etc, to allow for a easy drop machine in line type move. ( is this possible) | My question is what type of communication cable would
Electronics Forum | Thu May 06 19:13:24 EDT 2004 | Greg York
Watch your dwell time especially if larger components. Problem is normally associated with lower temp as well as insufficient flux coverage with larger massed boards or ground planes. Try to hand spray a board to check that fluxer operation is OK. If
Electronics Forum | Wed Oct 31 09:09:35 EDT 2007 | russ
Small waves are fine, biggest problem is the little to no preheat length. This is reason that complex boards cannot be soldered without defects. They also do not handle thick PCBas very well either because of same issue. Most of these "benchtops"
Electronics Forum | Thu Jul 03 17:22:03 EDT 2008 | mikesewell
On an ACE KISS machine we could program a drop in Z height to give a peel off angle after the component was soldered. Usually not necessary as the solder at the nozzle is falling away from the lead down the nozzle. If possible, we would program a fr
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Wed May 10 00:27:46 EDT 2006 | Chris
Russ, By a longer profile you mean a more even slope across the entire profile. Unfortunately I only have a 5 zone oven that is fairly short. How many heated zones are you using? Did you shrink the 0402 pad design and leave less pad exposed out a
Electronics Forum | Mon Jul 14 16:11:58 EDT 2008 | ck_the_flip
Pat, Try to run a glass plate (yeah I've used these before too), keep your wave pump speed the same, and slow down your conveyor speed. You will find the actual contact between molten solder and the 0.5" grids to be LESS vs. a faster conveyor speed
Electronics Forum | Tue Nov 14 13:39:37 EST 2000 | Mark S
Hi All -- I'm about to design a DPAK part (case 369A-13, Issue Z)onto a PCB . The part's maximum length as given in the datasheets (On-Semi MAC4DHM) is 0.030" longer than the recommended land pattern as given in that same datasheet. (1) Has anybod
Electronics Forum | Sun Dec 05 22:43:27 EST 1999 | dreamsniper
Charley, Though my reply is quite late, it might be a good info for you and i hope that this info could help or could provide you some views. Some companies practice at least 1 board gap, which means the length of the pcb you are currently loading,
Electronics Forum | Thu Jun 16 17:31:14 EDT 2005 | Doug
Chris, From your email I am assuming you are using an immersion tin process. Is that correct? If so, I would highly recommend you talk to your board house about the amount of tin that is being deposited on your boards. If the tin deposit becomes ver