Full Site - : longer clinch length (Page 13 of 16)

Spray fluxing VOC free, as operation HOURS before wave solder

Electronics Forum | Wed Sep 20 10:36:27 EDT 2006 | proy

I am considering moving my spray fluxer into a completely separate operation. Has anybody any comments of sraying VOC free flux on boards, then putting them in a drier/holding rack for possibly say overnight, then running them through wave solder?

NiPdAu Soldering Problems?

Electronics Forum | Fri Sep 19 21:31:15 EDT 2008 | trynders

Thanks for the response guys! The parts are being sent to a local lab as we speak. I'll let you know the results when I get them. I am not sure the purpose of the copper band, but the black around the band is just shadowing from how I took the pi

ESD Protection - Hair

Electronics Forum | Thu Aug 30 13:26:40 EDT 2012 | joeherz

Appreciate all the replies. We have a good system in place with ESD tile floor, grounded systems/benches/etc and heel and wrist strap usage and monitoring. Good training program as well. We've recently upgraded to the 2007 version of the ANSI 20.2

Problems placing PLCC4 parts with Fuji IP1 - any help/ideas?

Electronics Forum | Wed Oct 15 15:08:05 EDT 2008 | mbrunton

I have a Fuji IP1 using the MCS control system. Everything works fine, but it seems to have tons of problems placing PLCC4 parts (Osram Power TopLED). Some reels I load up it will give a vision processing error for about 1 out of 10 parts. Other r

0402 tombstoning

Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect

We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

OSP vs HASL

Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri

The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 17:31:08 EST 2001 | davef

Hold off on the sharp knife for little bit. [Yano, I get "queasy" when I see much of my blood, but other people�s blood doesn�t bother me much. Weird, eh?] [Oh bye-da-bye, I didn�t win the bar bet on "Ground Hog Day". I didn�t loose it either. T

Soldering BGA

Electronics Forum | Tue Jun 25 05:00:00 EDT 2002 | ianchan

Hi mate, "inadequate/not reliable" is a performance basis lingo term used for machines that are not treated like the precious things they are. treat em well and they will work reliable enough for you. ill-treat and scrimp on the PM(maintenance) and

Wave Soldering - Icicling/Bridges

Electronics Forum | Thu Jan 23 20:27:54 EST 2003 | joeherz

Hello, We recently installed a new/used UPK 650 fitted with a foam fluxer using an RMA flux chemistry. We have had problems with icicling and bridging from the beginning. The bridging occurs mostly on DIPs and connectors. The icicling is on longer


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