Industry News | 2012-04-27 19:20:10.0
PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.
Industry News | 2012-07-17 20:55:30.0
First Step in IPC’s Printed Electronics Initiative to Help Industry Grow
Industry News | 2024-03-11 14:58:44.0
New this year, student scholarship awarded by IPC Education Foundation
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
ESD dry cabinet for YSAK-2000 Specifications Dry cabinet 1.MOQ:1pc 2.CE ISO approved 3.1.2 steel,4mm tempered glass 4.switzerland humidity sensor ESD dry cabinet for 1.Mode
Industry Directory | Manufacturer
Leading EMS company in Denmark, operating in two modern assembly plants, one in Jutland and one close to Copenhagen. One plant is dedicated highly automated volume production and the other plant is a High Mix / Low Volume site. We have a high competence in SMT technology, and operates in 3 shifts with 6 complete SMD lines, AOI, X-ray, Flying Probe, MDA and ICT test systems.
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry Directory | Manufacturer
Offering: Monodisperse spacer grade microspheres, used in bond line spacing of electronic displays, flip chip technology, optics mounting, filters, microscopy, and electronic equipment. Precision narrow size ranges.
Industry Directory | Manufacturer
Manufacturer of base materials for the PCB industry. Our main products are copper clad laminates (CCL), prepregs (PP) and Mass Lamination boards (Mass Lam PCBs).
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability. RO3000 serie
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