As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
New Equipment | Board Handling - Storage
The ISM1100 Citadel has been specifically designed to achieve an optimum performance in regards to storage capacity and total size that guarantees to keep components safe while allowing for easy and intelligent management of component inventory. With
Nano Tribometer In Nanotribometry, a flat, a pin or a sphere is loaded onto the test sample with a precisely known force.The friction coefficient is determined during the test by measuring the deflection force on the arm. Wear coefficients for the
New Equipment | Board Handling - Conveyors
Detailed Product Description Capacity: 480L Outside size:W600*D700*H1276mm Inside size: W596*D670*H1218mm RH range: 1%-40%RH Display: Microcomputer LCD display Shelves: 3 Power consumption: av 32W Voltage: 110-220V Characte
New Equipment | Board Handling - Conveyors
Detailed Product Description Capacity: 495L Outside size: W1000*D480*H1100mm Inside size: W996*D450*H1042mm RH range: 1%-40%RH Display: Microcomputer LCD display Shelves: 3 Power consumption: av 32W Voltage: 110-220V Charac
Industry News | 2010-08-10 14:16:50.0
The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention & Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.
Honeywell TruStability® Board Mount Ultra-Low Pressure Sensors HSC Series and SSC Series extend the TruStability® low- to mid-pressure product line originally launched in 2009. These devices make use of new Honeywell proprietary technology th
Industry News | 2021-08-20 01:17:57.0
Totech Canada and Loggerflex Smart Devices collaboration on the Totech Labelled Bun HYGRO X PLUS is a easy to use accurate temperature and relative humidity (RH) recorder and alarm system at very low
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
New Equipment | Test Equipment
The Agilent 81634B optical power sensor is the right choice for accurate power measurements on fiber optic devices. The modular sensor fits into all Agilent 816x Lightwave mainframes and can be used singly or in multiples for parallel measurements of
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