New Equipment | Test Equipment
Description This product is discontinued. Support life for the 8757D will be through January 1, 2016. Accessory products for the 8757D will continue to be orderable through November 30, 2014. Support life for the accessories will be through Januar
New Equipment | Test Equipment
Description This product is discontinued. Support life for the 8757D will be through January 1, 2016. Accessory products for the 8757D will continue to be orderable through November 30, 2014. Support life for the accessories will be through Januar
CEPA produces and delivers coaxial cable assemblies for aerospace, military and commercial interconnect applications. High performance, low loss phase stable,phase matched, radiation hardened,space qualified,high temperature, ruggedized.
Technical Library | 2019-05-08 21:52:28.0
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
Industry Directory | Manufacturer
Manufacturer of base materials for the PCB industry. Our main products are copper clad laminates (CCL), prepregs (PP) and Mass Lamination boards (Mass Lam PCBs).
New Equipment | Assembly Services
The ferrite transformers are primarily designed for higher frequency applications. Power ferrite transformers provide benefits of low electrical losses and high permeability. The ferrite cores are constructed in compact sizes. Features and Specific
Industry Directory | Manufacturer
Toppan is a manufacturer of bare PWBs. Technology includes 2-32 layers, standard technology and advanced technology. Delivery in 3-20 days. Excellent six sigma based quality system.
Industry Directory | Consultant / Service Provider / Manufacturer
Qmax offers comprehensive PCB design services for OEMs in Medial, Aerospace and Telecom markets. We have successfully designed hundreds of boards that meet the most stringent compliance requirements.
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
