Industry Directory: low silver (6)

Remtec, Inc.

Industry Directory | Manufacturer

US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).

Qualitek International, Inc.

Industry Directory | Manufacturer

Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified

New SMT Equipment: low silver (21)

KappZapp7 Audiophile - the tin silver solder for speakers and audio equipment

KappZapp7 Audiophile - the tin silver solder for speakers and audio equipment

New Equipment | Solder Materials

The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper

Kapp Alloy & Wire, Inc

KappZapp3.5™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp3.5™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

KappZapp3.5™ is the most popular of the low temperature Silver bearing solders. It melts completely at just 430°F (221°C). This minimizes the heat applied to your sensitive electronic parts and minimizes distortion of thin wire or tabs. Learn more

Solder Direct

Electronics Forum: low silver (77)

Palladium silver surface finish

Electronics Forum | Thu Aug 12 18:06:09 EDT 2004 | SR

May I ask what component types you are using and who the suppliers are? FYI - If the components have exceeded their shelf life, they may have oxidized too much for soldering using low activity fluxes. Thanks and best regards, SR

Immersion silver leaching.

Electronics Forum | Tue Apr 13 07:48:00 EDT 2004 | Dougie

Hi Ken, Our product is consumer, although our product is sold on it's reliability. We run a low volume high mix throughput. Any ideas on timescale for the Ag leaching? Sounds like it could be a safer bet to use Imm Sn boards with the Sn/Cu/Ni bar w

Used SMT Equipment: low silver (1)

Industry News: low silver (219)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

GPD Global's MAX Series Provides Maximum Accuracy

Industry News | 2011-04-22 21:36:56.0

GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.

GPD Global

Parts & Supplies: low silver (9)

MPM P7062 Emergency switch contacts Block

MPM P7062 Emergency switch contacts Block

Parts & Supplies | SMT Equipment

Emergency switch contacts Block(P7062) Product Name: P7062 emergency switch contacts Block    Part Number: P7062    Description: P7062 BLOCK, CONTACT, 2XNC, GOLD FLASHED    SILVER emergency switch contacts Block    Applicable models: UP; AP

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki E3606-729-0A0 JUKI NOZZLE 507

Juki E3606-729-0A0 JUKI NOZZLE 507

Parts & Supplies | SMT Equipment

JUKI E3606-729-0A0 JUKI NOZZLE 507 ASSY JUKI E3606-729-0A0 JUKI NOZZLE 507 ASSY JUKI 507 NOZZLE 508 NOZZLE ON KE2000 MACHINES JUKI NOZZLE 500 NOZZLE ASEMBLY 40011046 JUKI NOZZLE 501 NOZZLE ASEMBLY 40001339 JUKI Nozzle 502 NOZZLE ASEMBLY 40001340 J

ZK Electronic Technology Co., Limited

Technical Library: low silver (12)

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications

Technical Library | 2010-08-19 18:33:17.0

The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to

Heraeus

Videos: low silver (6)

RCM-H1000D Desktop automatic centrifugal mixer-temperature recovery type

RCM-H1000D Desktop automatic centrifugal mixer-temperature recovery type

Videos

RCM-H1000D series Desktop automatic centrifugal mixer-temperature recovery type One.piece use clause H1000D desktop automatic centrifugal mixer is based on current technology and safety standards: GB4793.1-2007 "Safety requirements for electrical eq

Qinyi Electronics Co.,Ltd

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

Videos

Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC Inc.

Events Calendar: low silver (2)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: low silver (2)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Technology NPI R&D Eng Tec

Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support

Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic

Express Newsletter: low silver (403)

SMTnet Express - Septemeber 1, 2016

SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305

SMTnet Express - October 2, 2014

SMTnet Express, October 2, 2014, Subscribers: 23352, Members: Companies: 14077, Users: 36923 Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa; Flextronics

Partner Websites: low silver (328)

Do You Know All of the Applications for Soldering? - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/do-you-know-all-of-the-applications-for-soldering/

).  Although these low melt alloys do not stress the physical components the shear and tensile strength characteristics of these low temperature alloys are typically not used or suitable for mechanical

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

– Joints Look Ugly but are fine • Bismuth – Reduces melting point but joints can be brittle depending on formulation • Antimony – – Gives better stability at low temperatures when used with tin

Heller Industries Inc.


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