Industry Directory | Manufacturer
We are a manufacturer of Reed Switches, SMD Reed Sensors and other customized Magnetic sensing solutions, incorporated in 1971.
Industry Directory | Manufacturer
We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson
Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan
Used SMT Equipment | Circuit Board Assembly Products
All-purpose V-CUT PCB Separator SM-4000 Straight Knife PCB depaneling machine, PCB singulation - Pneumatically driven and electric control The machine is pneumatically driven and electric control. The straight knife type depaneling machines were
Used SMT Equipment | Soldering - Reflow
Intelligent hot air lead-free reflow Oven with six heating-zones TN360C Instruction: 1: Heating system: TN360C adopts high effective nickel-chromium heating tube with advanced technology and Long life service. The hot-air circle system wh
Industry News | 2022-10-14 02:39:56.0
I.C.T M series pick and place machine is mainly used for the production of LED lamps. Its positioning is aimed at small and medium-sized LED manufacturers or LED companies that have just started a business. Due to its low initial investment, the cost performance is very high.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Parts & Supplies | Pick and Place/Feeders
YMH CL-Type Part Name：HAND LEVER ASSY PART No：KW1-M114A-00X Part Name：SPROCKET AXIS ASSY PART No：K87-M112L-10X Part Name：INDENTATION LVR ASSY PART No：KW1-M1192-00X Part Name：LEVER AXIS PART No：KW1-M116K-00X Part Name：RACKING LEVER ASSY
Parts & Supplies | Pick and Place/Feeders
YAMAHA FEEDER PARTS Part Name：HAND LEVER ASSY PART No：KW1-M114A-00X Part Name：SPROCKET AXIS ASSY PART No：K87-M112L-10X Part Name：INDENTATION LVR ASSY PART No：KW1-M1192-00X Part Name：LEVER AXIS PART No：KW1-M116K-00X Part Name：RACKING LEVER
Technical Library | 2019-05-30 11:04:03.0
There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures reduces the thermal stress on electronic devices, which improves efficiency and reduces failures. To improve the heat removal process, the current heat transfer design of a power system has been analyzed and a variety of thermal interface materials (TIMs) and cold plate technologies have been evaluated. This paper will review some of these results.
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
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KingFei SMT Tech | https://www.smtspare-parts.com/sale-36275313-klw-m914w-000-plate-spring-for-yamaha-nozzle-shaft.html
KLW-M914W-000 Plate Spring For Yamaha Nozzle Shaft Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/pelletizers/wrp-12i-in-line-pelletizer
: Uniform polymer flow to die plate Lower inlet pressure = increased rates Rapid blade and die plate removal Fast color changes Easy clean-out Simple start-up and operation Improved pellet dryness Easy dryer access and cleanability Insensitive to process variations Features
