Full Site - : m.o.l.e (Page 1 of 6)

Vitronics XPM2 + 520

Vitronics XPM2 + 520

Used SMT Equipment | Soldering - Reflow

Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5

SMTUNION

SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards

Industry News | 2011-09-06 15:20:36.0

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Surface Mount Technology Association (SMTA)

Tektronix M.O.L.E. Xpert 3 Oven rider, Wave rider, M.O.L.E. Thermal Profiler and Xpert 6 Super M.O.L.E Gold

Tektronix M.O.L.E. Xpert 3 Oven rider, Wave rider, M.O.L.E. Thermal Profiler and Xpert 6 Super M.O.L.E Gold

Used SMT Equipment | Sensors

ECD M.O.L.E. Lot comes with the following, everything is complete and fully functional, manuals included, plus and spare parts. 1) ECD M.O.L.E. Xpert 3 profile module 2) ECD Xpert 3 Docking station 3) SUPER M.O.L.E. Gold thermocouple system. 4) ECD O

Scientific Devices Exchange LLC. DBA SD Exchange

SuperM.O.L.E.® Gold 2  Flux and Wave Solder Thermal Profilers

SuperM.O.L.E.® Gold 2 Flux and Wave Solder Thermal Profilers

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

M.O.L.E.® Reflow Oven Thermal Profilers

M.O.L.E.® Reflow Oven Thermal Profilers

New Equipment | Reflow

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

Do You Own the Oldest M.O.L.E.®? Enter to Win a SuperM.O.L.E.® Gold 2 kit

Industry News | 2012-11-05 14:21:13.0

ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit

Electronic Controls Design Inc. (ECD)

AutoM.O.L.E.® Xpert Automatic Reflow Oven Setup & Profile Replication System With Built-in Robust Profile Planning Tool

AutoM.O.L.E.® Xpert Automatic Reflow Oven Setup & Profile Replication System With Built-in Robust Profile Planning Tool

New Equipment | Reflow

Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr

Electronic Controls Design Inc. (ECD)

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

OvenCHECKER™ Reflow Oven Verification Tool

OvenCHECKER™ Reflow Oven Verification Tool

New Equipment | Reflow

Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr

Electronic Controls Design Inc. (ECD)

ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings

Industry News | 2012-05-31 14:49:02.0

Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.

Electronic Controls Design Inc. (ECD)


m.o.l.e searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

High Throughput Reflow Oven
SMTAI 2024 - SMTA International

World's Best Reflow Oven Customizable for Unique Applications
used smt parts china

High Resolution Fast Speed Industrial Cameras.
SMT spare parts

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...