Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronic manufacturing service providers that want to grow their business and OEMs requiring high quality large board dispensing now have a solution in the PPM 5000 Dispensing system. It is fully-automatic Large Board SMT Dispenser. Manufacturers
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Tue Feb 21 10:58:02 EST 2012 | ppcbs
Can anyone suggest a good underfill compound that is readily available for manual dispensing. I need to underfill a small BGA less that 12mm square.
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictures and inform
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale We have (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictu
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2015-06-02 13:40:01.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN) announces the sale of two Spectrum™ II S2-922 in-line dispensing systems to GN ReSound, one of the world's largest manufacturers of hearing healthcare solutions. GN ReSound, based in Ballerup, Denmark with production facilities in Præstø, Denmark, presently has an installed base of off-line Nordson ASYMTEK coating systems and Axiom™ X-1000 dispensers. The Spectrum II systems are being used as part of automated manufacturing production lines to apply underfill in the manufacture of hearing aids
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Method for Automated Nondestructive Analysis of Flip Chip Underfill News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Method for Automated Nondestructive Analysis of Flip
Method for Automated Nondestructive Analysis of Flip Chip Underfill News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Method for Automated Nondestructive Analysis of Flip
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
1706 exl 1800exl 1707 mark 5 heller Uf3800 underfill Hac1 manual Vapor phase reflow Rma 204 Reflow soldering on surface mount Reflow qfn Reflow temperature for lead solder Hex250l Training Reflow
GPD Global | https://www.gpd-global.com/co_website/literature-coating.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
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