Electronics Forum | Mon Nov 08 13:14:35 EST 2010 | rway
If you are just wanting to test the values of the electrolytics or tantalums, it's not a problem with an ICT, as long as your system has an analog instrument to do it. If you are wanting to test the polarity of the cap, you will need a capacitive co
Electronics Forum | Mon Aug 29 13:01:57 EDT 2005 | stalkerb
PR thankyou for your feedback, your comments are extremely helpful. We have a customer product porfolio of about 900 active products, covering approx 700 different fabs. your comments are absolutely valid with regards to Speed, however in our scena
Industry News | 2022-04-28 14:20:24.0
IPC releases PCB industry results for March 2022
Industry News | 2022-01-03 07:42:02.0
IPC Releases EMS Industry Results for November 2021
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 87, (#ts#)) SMT Express, Special Edition, Issue 1 - from SMTnet.com Special Edition Issue 1 Featured Article Return
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
(solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
side reflow Ensure a robust surface finish that remains solderable after 2 heat cycles. In circuit test strain limits could be larger with thicker boards. ICT stress must be minimal to prevent BGA fracture Ensure low contact resistance on test points
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