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Void Detection in Large Solder Joints of Integrated Power Electronics
SMTnet Express January 31 - 2013, Subscribers: 26152
SMTnet Express March 28 - 2013, Subscribers: 26288
SMTnet Express April 11 - 2013, Subscribers: 26336
Head-in-Pillow BGA Defects
Economics, Technology Drive Industry To Non-Intrusive Board Test
Matrix Maintenance in PXI with BIRST
Total Loss: How to Qualify Circuit Boards
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
Advances in Conductive Inks across Multiple Applications and Deposition Platforms
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
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[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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