Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2010-10-01 01:05:06.0
Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2013-11-27 15:30:07.0
Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
Industry Directory | Consultant / Service Provider / Manufacturer
Delkin Devices, Inc. is an independently owned business and the largest US memory card manufacturer in San Diego, CA.
Industry News | 2022-04-13 09:47:35.0
MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, "Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?" on April 19 at 10:30 am New York / 3:30 pm London.
Industry News | 2011-08-01 16:57:15.0
Quicktronics PCB & Electronics Service GmbH, German outsourcing partner in the field of printed circuit boards, announce the opening of an office in Poland. This new subsidiary will help Quicktronics clients in Northeastern Europe to benefit more rapidly and more efficiently from Quicktronics' competence.
Industry News | 2012-11-29 13:46:02.0
In October, Universal Instruments Corporation’s Advanced Process Lab (APL) held its third Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2012 at Binghamton University’s Innovative Technologies Complex in Vestal, N.Y. The 25-member consortium, organized by Universal, helps member organizations identify and develop new and emerging technologies, generating applicable knowledge for specific product development and manufacturing processes.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2011-11-08 13:50:15.0
Christopher Associates announced that it will sponsor presentations given by noted industry expert Chrys Shea on ways to improve the stencil printing process, a key factor in the profitability of a circuit assembly operation, this week at the SMTA Houston Chapter Meeting and Austin Expo & Tech Forum
Industry News | 2013-09-17 15:54:46.0
SMART Group announces that its annual SMART Group European Conference & Table Top Exhibition will be held from 2-3 October 2013 at the Spread Eagle Hotel in Cornmarket Thame, Oxfordshire, England.
