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sales5_etlimited_cn china ceramic pcb,china ceramic pcb single layer key speciafications/special features: Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc. pcb Board thickness: 0.30 to
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sales5_etlimited_cn Aluminium PCB,single sided PCB,China PCB&PCBA manufacturer key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc. Board th
Technical Library | 2016-05-19 16:03:37.0
As consumers become more reliant on their handheld electronic devices and take them into new environments, devices are increasingly exposed to situations that can cause failure. In response, the electronics industry is making these devices more resistant to environmental exposures. Printed circuit board assemblies, handheld devices and wearables can benefit from a protective conformal coating to minimize device failures by providing a barrier to environmental exposure and contamination. Traditional conformal coatings can be applied very thick and often require thermal or UV curing steps that add extra cost and processing time compared to alternative technologies. These coatings, due to their thickness, commonly require time and effort to mask connectors in order to permit electrical conductivity. Ultra-thin fluorochemical coatings, however, can provide excellent protection, are thin enough to not necessarily require component masking and do not necessarily require curing. In this work, ultra-thin fluoropolymer coatings were tested by internal and industry approved test methods, such as IEC (ingress protection), IPC (conformal coating qualification), and ASTM (flowers-of-sulfur exposure), to determine whether this level of protection and process ease was possible.
Industry News | 2021-01-30 07:05:46.0
Most wave soldering systems installed in electronic productions are equipped with one or two solder nozzles that generate a turbulent wave. This configuration is ideal for most products; however, this concept reaches its limitations if, for example, PCBs in masks are to be processed. The reliable wetting of all solder jointsis not guaranteed, depending on the thickness of the mask and the size of the cutouts. Additionally, it might be challenging to achieve a reproducible process if the distances between covered SMD components and the THT pins to be soldered are too small. Sophisticated assemblies that are processed in soldering masks often show soldering defects such as incomplete solder joints or solder bridges.
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Specification: Backing: Kraft paper Adhesive: rubber Length: 200/500mm Thickness: 0.11mm Adhesion: 4N/in Tensile strength: 130N/in Features: Low initial tack Self-sticky can get good adhesion Made of crepe and Kraft paper of good masking e
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Used SMT Equipment | Coating and Encapsulation
The SCS P-3201 Dip Coat System is a free-standing precision dip coater designed to coat circuit boards in non-automated production settings. With this system, you can effectively and efficiently apply a range of coatings, including urethane, epoxy, s