Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
New Equipment | Assembly Services
TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
New Equipment | Assembly Services
TW-FPC--Flexible PCB 0187 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units p
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?
Electronics Forum | Thu Aug 05 14:45:03 EDT 2004 | davef
Bright vs matte tin is fairly easy, but there's a s whole bunch of alternatives, beyond those two choices. So, no, not that we know.
Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Industry News | 2013-10-01 18:21:25.0
IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2015-10-22 17:37:28.0
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic, polyurethane and parylene. Also included in this paper are tin whisker inspection results of tin-plated braiding and wire that was exposed to an environment of 50°C with 50% relative humidity for over five years.
https://www.ascen.ltd/Products/conformal_coating_equipment//580.html PCB Conformal coating machine is used to paint conformal coating onto full LED panel to avoid PCB moisture,sault and static.It can be full panel conformal coating or selective coati
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
: White Insulating Layer Finish: Matte or Polish Standard Roll Widths: up to 48” wide Standard Gauges (insulating layer): 0.005”, 0.010”, 0.015”, 0.020”, 0.030” Available Foils: Aluminum, Copper, Tin Plated Copper
| https://www.eptac.com/wp-content/uploads/2020/02/eptac_webinar_03-18-20.pdf
” 4 J-STD-001/610 • Tin mitigation plan according to GEIA- STD-0005-2 will be necessary, or have some plan identifying how it is being handled by the industry • The question is
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